ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,789, issued on Nov. 3, was assigned to KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY (Seoul, South Korea). "Security code including metamaterial... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,790, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package having an antenna patter... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,791, issued on Nov. 3, was assigned to STATS ChipPAC Pte. Ltd. (Singapore). "Semiconductor device and method of forming selective shielding ... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,792, issued on Nov. 3, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Transmission line structure with ... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,793, issued on Nov. 3, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Resistance temperature detector at hybrid bond... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,794, issued on Nov. 3, was assigned to Qorvo US Inc. (Greensboro, N.C.). "Front-end module with vertically stacked die and circulator" was i... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,795, issued on Nov. 3, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Modular package structures with interposers ha... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,796, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Package-on-package (POP) type semiconductor pa... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,797, issued on Nov. 3, was assigned to MOSAIC MICROSYSTEMS LLC (Rochester, N.Y.). "Facilitating formation of a via in a substrate" was inven... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,798, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Method of fabricating semiconductor package" w... Read More